FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation

This paper presents a 3D direct numerical simulation of buckled thin-film packaging based on transferred elastic wrinkling bonded compliant polymer ring. The mode change the fabricated cap is found by measuring shape at different times after Si substrate debonding. conventional linear and nonlinear buckling simulations are not adequate to understand behavior mechanism creating such change. Direct recently reported as an easy useful method. A novel FEM model package suitable for built reduce mixture between modes. Buckling modes investigated in terms moduli materials applied strain due thermal expansion coefficient difference. Based results, it that there two main determining cover depending elasticity ratio sealing ring materials. shift from out-of-plane along polymeric found.